High-precision stacked circuit boards with 4–20 layers support mixed voltage structure, blind and buried via technology, and multi-layer impedance control, and are suitable for high-end equipment in industrial control, medical, communication, and server applications.
Specifications: 4–20 layers; board thickness 0.8–4.0mm; impedance accuracy ±5%; maximum board size 1000×600mm; supports blind vias, buried vias, resin-filled vias, and multi-level impedance matching.
Our factory's advantages: We possess advanced mixed-lamination and lamination balance technology, ensuring high multilayer alignment accuracy and excellent board warpage control. We can undertake highly complex and precise custom multilayer board orders.