HDI PCB
Description
High-density microvia interconnect circuit boards feature denser circuitry, thinner and lighter boards, and lower signal loss, making them widely used in 5G, smart wearables, mobile phones, automotive radar, and precision digital products.
Product Details
Specifications: Minimum laser blind via 0.075mm; Maximum linewidth/spacing 0.05/0.05mm (2mil); Mass production linewidth/spacing 0.075/0.075mm (3mil); Supports 1+n and 2+n arbitrary layer structures; Low-loss high-frequency board material optional.
Our factory's advantages: Equipped with fully automated laser drilling and LDI precision exposure equipment, achieving high micro-via forming yield; mature high-speed signal processing technology, enabling stable mass production of high-end precision HDI boards.
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